The CMKD-0410A Series is an ultra-low-profile, high-current SMD Molded Inductor. It is specifically engineered for height-critical applications, fitting within a 4.4 mm × 4.2 mm footprint with an exceptionally slim 1.0mm maximum height.
This series utilizes a powder iron core material in a one-piece, magnetically shielded construction to ensure low EMI and minimal core loss. Despite its ultra-thin profile, this low profile inductor provides a useful inductance range up to 10.0µH and is optimized for high-frequency (up to 5MHz) DC-DC converters. As a leading power inductor manufacturer, Magsonder designed the CMKD-0410A as an ideal inductor for dc-dc converter applications in the most space-constrained devices.
Key Features
Ultra-Low Profile: 1.0mm maximum height.
Compact Footprint: 4.4 mm × 4.2 mm.
Molded Construction: Magnetically shielded for low EMI.
High Frequency Operation: Optimized for frequencies up to 5MHz.
High Current Capacity: Features low DCR for high efficiency.
Halogen-Free & RoHS Compliant.
Operating Temperature: -55°C to +125°C.
Applications
The CMKD-0410A's ultra-slim design makes it a premier choice for high-density, height-restricted power circuits:
Smart phone POL modules
1
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SSD modules
2
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Notebook regulators
3
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Point-of-load (POL) modules
4
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Voltage Regulator Modules (VRM)
5
Electrical Characteristics
|
Part No. |
Inductance (L₀) (µH) (±20%) |
Test condition |
DCR (mΩ) TYP. |
DCR (mΩ) MAX. |
Isat (A) TYP. |
|
CMKD-0410A-1R0M |
1.0 |
100 kHz, 1V |
50.0 |
60.0 |
4.0 |
|
CMKD-0410A-2R2M |
2.2 |
100 kHz, 1V |
92.0 |
110.0 |
3.0 |
|
CMKD-0410A-4R7M |
4.7 |
100 kHz, 1V |
230.0 |
210.0 |
2.0 |
|
CMKD-0410A-6R8M |
6.8 |
100 kHz, 1V |
190.0 |
215.0 |
1.8 |
|
CMKD-0410A-100M |
10.0 |
100 kHz, 1V |
265.0 |
335.0 |
1.6 |
Notes:
Test Conditions: All test data is referenced to 25°C ambient.
Operating Temperature Range: -55°C to +125°C (ambient plus self-temperature rise).
Isat (Saturation Current): DC current (A) that will cause L₀ to drop approximately 30%.
Idc (Rating Current): DC current (A) that will cause an approximate ΔT of 40°C.
Temperature Limit: The part temperature (ambient + temp rise) should not exceed 125°C under worst-case operating conditions.
Performance Graphs
Shape and Dimensions
Reliability
This product is qualified against a series of mechanical and endurance tests, including Solder Heat Proof, Thermal Shock, Humidity Resistance, and Vibration. (See PDF page 24 for full details).
Packaging
Packaging: Embossed Carrier Tape
Reel Diameter: 330 mm
Tape Width: 12 mm
Quantity/Reel: 3000 pcs
Solder Reflow Profile
Preheat condition: 150~200°C / 60~120 sec.
Allowed time above 217°C: 60~90 sec.
Max temp: 260°C (compliant with J-STD-020D)
Max time at max temp: 10 sec.
Allowed Reflow time: 2x max
Solder paste: Sn/3.0Ag/0.5Cu
(Note: This profile is for qualification only. Actual profiles must be based on the customer's specific board design and process.)
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