The CMKD-252012A Series is a miniature, ultra-low-profile SMD Molded Inductor. It is one of the most compact inductors in the CMKD family, featuring a tiny 2.5 mm × 2.0 mm footprint and an ultra-slim 1.2mm maximum height.
This series is specifically engineered for high-density, space-critical applications. It utilizes a one-piece, magnetically shielded construction from powder iron core material to ensure low EMI and low core loss in a miniature package. Optimized for high-frequency (up to 5MHz) DC-DC converters, this miniature SMD inductor is the ideal choice for smartphone power rails, SSD modules, and other handheld devices. The CMKD-252012A is available in our inductor online store and is an excellent power inductor for smartphone POL modules.
Key Features
Miniature Footprint: 2.5 mm × 2.0 mm.
Ultra-Low Profile: 1.2mm maximum height.
Molded Construction: Magnetically shielded for low EMI, ideal for dense PCBs.
High Frequency Operation: Suitable for frequencies up to 5MHz.
High-Density Solution: Perfect for space-constrained mobile applications.
Halogen-Free & RoHS Compliant.
Operating Temperature: -55°C to +125°C.
Applications
The CMKD-252012A's miniature design is essential for the smallest power circuits:
Smart phone POL modules
1
>>
SSD modules
2
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Point-of-load (POL) modules
3
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Wearable devices
4
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High-density notebook regulators
5
Electrical Characteristics
|
Part No. |
Inductance (L₀) (µH) (±20%) |
Test condition |
DCR (mΩ) TYP. |
DCR (mΩ) MAX. |
Isat (A) TYP. |
Idc (A) TYP. |
|
CMKD-252012A-R47M |
0.47 |
1MHz, 1V |
29 |
39 |
4.7 |
4.4 |
|
CMKD-252012A-1R0M |
1.0 |
1MHz, 1V |
45 |
59 |
3.8 |
3.5 |
|
CMKD-252012A-1R5M |
1.5 |
1MHz, 1V |
60 |
72 |
3.3 |
2.8 |
|
CMKD-252012A-2R2M |
2.2 |
1MHz, 1V |
90 |
108 |
2.7 |
2.3 |
|
CMKD-252012A-3R3M |
3.3 |
1MHz, 1V |
120 |
144 |
2.3 |
1.7 |
|
CMKD-252012A-4R7M |
4.7 |
1MHz, 1V |
200 |
240 |
1.9 |
1.5 |
|
CMKD-252012A-6R8M |
6.8 |
1MHz, 1V |
310 |
375 |
1.6 |
1.2 |
|
CMKD-252012A-100M |
10.0 |
1MHz, 1V |
460 |
400 |
1.3 |
1.0 |
Notes:
Test Conditions: All test data is referenced to 25°C ambient.
Operating Temperature Range: -55°C to +125°C (ambient plus self-temperature rise).
Isat (Saturation Current): DC current (A) that will cause L₀ to drop approximately 30%.
Idc (Rating Current): DC current (A) that will cause an approximate ΔT of 40°C.
Temperature Limit: The part temperature (ambient + temp rise) should not exceed 125°C under worst-case operating conditions.
Performance Graphs
Shape and Dimensions
Reliability
This product is qualified against a series of mechanical and endurance tests, including Solder Heat Proof, Thermal Shock, Humidity Resistance, and Vibration. (See PDF page 24 for full details).
Packaging
Packaging: Embossed Carrier Tape
Reel Diameter: 180 mm
Tape Width: 8 mm
Quantity/Reel: 3000 pcs
Solder Reflow Profile
Preheat condition: 150~200°C / 60~120 sec.
Allowed time above 217°C: 60~90 sec.
Max temp: 260°C (compliant with J-STD-020D)
Max time at max temp: 10 sec.
Allowed Reflow time: 2x max
Solder paste: Sn/3.0Ag/0.5Cu
(Note: This profile is for qualification only. Actual profiles must be based on the customer's specific board design and process.)
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