The CMKD-0320A Series is a miniature, high-current SMD Molded Inductor. It is engineered for extreme space efficiency, featuring a compact 3.5 mm × 3.2 mm footprint and a low 2.0mm profile.
This series utilizes a powder iron core material in a magnetically shielded, one-piece molded construction to minimize EMI and core loss. Despite its small size, this shielded power inductor delivers excellent saturation current (Isat) up to 5.0A. The CMKD-0320A is a high-performance miniature inductor, halogen-free, RoHS-compliant, and designed for high-frequency applications up to 5MHz.
Key Features
Miniature Footprint: Only 3.5 mm × 3.2 mm with a 2.0mm max height.
High Current: Saturation (Isat) up to 5.0A and thermal (Idc) up to 4.0A.
Molded Construction: Magnetically shielded, low EMI, low core loss.
High Frequency: Suitable as a high frequency power inductor (up to 5MHz).
Halogen-Free & RoHS Compliant.
Operating Temperature: -55°C to +125°C.
Applications
The CMKD-0320A's miniature size and high-frequency capabilities make it an ideal SMD Molded Inductor for high-density, power-sensitive applications:
Smart phone POL modules
1
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SSD modules
2
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Point-of-load (POL) modules
3
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Notebook regulators
4
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Voltage Regulator Modules (VRM)
5
Electrical Characteristics
|
Part No. |
Inductance (L₀) (µH) (±20%) |
Test condition |
DCR (mΩ) TYP. |
DCR (mΩ) MAX. |
Isat (A) TYP. |
Idc (A) TYP. |
|
CMKD-0320A-1R0M |
1.0 |
100 kHz, 1V |
32.0 |
38.0 |
5.0 |
4.0 |
|
CMKD-0320A-1R5M |
1.5 |
100 kHz, 1V |
40.5 |
48.5 |
4.0 |
3.8 |
|
CMKD-0320A-2R2M |
2.2 |
100 kHz, 1V |
65.0 |
75.0 |
3.7 |
3.5 |
Notes:
Test Conditions: All test data is referenced to 25°C ambient.
Operating Temperature Range: -55°C to +125°C (ambient plus self-temperature rise).
Isat (Saturation Current): DC current (A) that will cause L₀ to drop approximately 30%.
Idc (Rating Current): DC current (A) that will cause an approximate ΔT of 40°C.
Temperature Limit: The part temperature (ambient + temp rise) should not exceed 125°C under worst-case operating conditions.
Performance Graphs
Shape and Dimensions
Reliability
This product is qualified against a series of mechanical and endurance tests, including Solder Heat Proof, Thermal Shock, Humidity Resistance, and Vibration. (See PDF page 24 for full details).
Packaging
Packaging: Embossed Carrier Tape
Reel Diameter: 330 mm
Tape Width: 12 mm
Quantity/Reel: 3000 pcs
Solder Reflow Profile
Preheat condition: 150~200°C / 60~120 sec.
Allowed time above 217°C: 60~90 sec.
Max temp: 260°C (compliant with J-STD-020D)
Max time at max temp: 10 sec.
Allowed Reflow time: 2x max
Solder paste: Sn/3.0Ag/0.5Cu
(Note: This profile is for qualification only. Actual profiles must be based on the customer's specific board design and process.)
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