The CMKD-0610A Series is an ultra-low-profile SMD Molded Inductor in a 6.1 mm × 6.1 mm footprint. It is defined by its exceptionally slim 1.0mm maximum height (0.8mm D-dimension), making it one of the thinnest power inductors available in its class.
This series is designed for the most height-restricted applications, such as high-performance PC cards and ultra-thin mobile devices. It utilizes a one-piece, magnetically shielded construction to ensure low EMI. This high saturation current inductor is optimized for high-frequency (up to 5MHz) DC-DC converters. The CMKD-0610A provides a saturation current (Isat) up to 7.5A, with popular values like the smd power inductor 10uh (CMKD-0610A-100M) offering a 1.6A thermal rating. If you're asking what is smd inductor's role in thin devices, this SMD Molded Inductor is a perfect example.
Key Features
Ultra-Low Profile: 1.0mm maximum height (0.8mm D-dimension).
6mm-Class Footprint: 6.1 mm × 6.1 mm.
High Saturation Current: Rated up to 7.5A.
Molded Construction: Magnetically shielded for low EMI and high efficiency.
High Frequency Operation: Suitable for frequencies up to 5MHz.
Halogen-Free & RoHS Compliant.
Operating Temperature: -55°C to +125°C.
Applications
The CMKD-0610A's ultra-thin design is essential for next-generation, space-constrained power rails:
Smart phone POL modules
1
>>
Ultra-thin notebook regulators
2
>>
SSD modules
3
>>
Point-of-load (POL) modules
4
>>
High-density Voltage Regulator Modules (VRM)
5
Electrical Characteristics
|
Part No. |
Inductance (L₀) (µH) (±20%) |
Test condition |
DCR (mΩ) TYP. |
DCR (mΩ) MAX. |
Isat (A) TYP. |
Idc (A) TYP. |
|
CMKD-0610A-1R0M |
1.0 |
100 kHz, 1V |
35.5 |
42.5 |
7.5 |
5.2 |
|
CMKD-0610A-6R8M |
6.8 |
100 kHz, 1V |
164.0 |
197.0 |
2.5 |
2.0 |
|
CMKD-0610A-100M |
10.0 |
100 kHz, 1V |
259.0 |
310.0 |
2.1 |
1.6 |
Notes:
Test Conditions: All test data is referenced to 25°C ambient.
Operating Temperature Range: -55°C to +125°C (ambient plus self-temperature rise).
Isat (Saturation Current): DC current (A) that will cause L₀ to drop approximately 30%.
Idc (Rating Current): DC current (A) that will cause an approximate ΔT of 40°C.
Temperature Limit: The part temperature (ambient + temp rise) should not exceed 125°C under worst-case operating conditions.
Performance Graphs
Shape and Dimensions
Reliability
This product is qualified against a series of mechanical and endurance tests, including Solder Heat Proof, Thermal Shock, Humidity Resistance, and Vibration. (See PDF page 24 for full details).
Packaging
Packaging: Embossed Carrier Tape
Reel Diameter: 330 mm
Tape Width: 16 mm
Quantity/Reel: 2000 pcs
Solder Reflow Profile
Preheat condition: 150~200°C / 60~120 sec.
Allowed time above 217°C: 60~90 sec.
Max temp: 260°C (compliant with J-STD-020D)
Max time at max temp: 10 sec.
Allowed Reflow time: 2x max
Solder paste: Sn/3.0Ag/0.5Cu
(Note: This profile is for qualification only. Actual profiles must be based on the customer's specific board design and process.)
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