The CD5845 Series is a high-performance, cost-effective wire-wound SMD Power Inductor. It features a 4.5mm profile and is engineered for applications demanding excellent current handling, offering a high saturation current (Isat) of up to 9.50A.
Built with a rugged, metallized ferrite core, the CD5845 series provides excellent shock resistance and durability. This high power inductor covers an extremely wide inductance range from 0.56µH up to 1000µH (1mH). The chosen inductor core material provides a great balance of performance and cost. The CD5845 ensures excellent solderability and is packaged in embossed carrier tape for automated SMT assembly, making it a versatile SMD Power Inductor for many designs.
Key Features
High Saturation Current: Rated up to 9.50A (Isat), ideal for power-intensive applications.
Wide Inductance Range: 0.56µH to 1000µH.
Rugged Construction: Ferrite drum core with metallization for high shock resistance.
Low DC Resistance (DCR).
Automation-Ready: Supplied in embossed carrier tape.
RoHS Compliant.
Applications
The CD5845's high current capability makes it an excellent choice for robust DC-DC converter inductors and as an inductor filter in various systems:
Notebooks, desktop computers, and servers
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LED Lighting
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Flat-screen TVs, blue-ray disc recorders, set-top boxes
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DC to AC inverters
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Telecom base stations
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Electrical Characteristics
|
Part No. |
Inductance (L) (µH) |
Test Frequency (kHz/Volt) |
DCR (Ω) MAX. |
Saturation Current (Isat) (A) MAX. |
|
CD5845-R56M |
0.56 ± 20% |
100/0.25 |
0.007 |
9.50 |
|
CD5845-1R0N |
1.0 ± 30% |
100/0.25 |
0.012 |
6.00 |
|
CD5845-1R5M |
1.5 ± 20% |
100/0.25 |
0.014 |
5.20 |
|
CD5845-2R2M |
2.2 ± 20% |
100/0.25 |
0.018 |
4.50 |
|
CD5845-3R3M |
3.3 ± 20% |
100/0.25 |
0.025 |
3.50 |
|
CD5845-4R7M |
4.7 ± 20% |
100/0.25 |
0.035 |
3.10 |
|
CD5845-6R8M |
6.8 ± 20% |
100/0.25 |
0.047 |
2.50 |
|
CD5845-8R2M |
8.2 ± 20% |
100/0.25 |
0.059 |
2.20 |
|
CD5845-100K |
10 ± 10% |
100/0.25 |
0.068 |
2.00 |
|
CD5845-120K |
12 ± 10% |
100/0.25 |
0.075 |
1.80 |
|
CD5845-150K |
15 ± 10% |
100/0.25 |
0.105 |
1.70 |
|
CD5845-220K |
22 ± 10% |
100/0.25 |
0.164 |
1.50 |
|
CD5845-330K |
33 ± 10% |
100/0.25 |
0.230 |
1.20 |
|
CD5845-470K |
47 ± 10% |
100/0.25 |
0.370 |
1.00 |
|
CD5845-560K |
56 ± 10% |
100/0.25 |
0.420 |
0.72 |
|
CD5845-680K |
68 ± 10% |
100/0.25 |
0.460 |
0.61 |
|
CD5845-101K |
100 ± 10% |
100/0.25 |
0.610 |
0.52 |
|
CD5845-151K |
150 ± 10% |
100/0.25 |
0.860 |
0.40 |
|
CD5845-221K |
220 ± 10% |
100/0.25 |
1.370 |
0.35 |
|
CD5845-331K |
330 ± 10% |
100/0.25 |
1.850 |
0.25 |
|
CD5845-391K |
390 ± 10% |
100/0.25 |
2.200 |
0.23 |
|
CD5845-471K |
470 ± 10% |
100/0.25 |
2.400 |
0.20 |
|
CD5845-681K |
680 ± 10% |
100/0.25 |
3.600 |
0.15 |
|
CD5845-102K |
1000 ± 10% |
1/0.25 |
5.760 |
0.13 |
Notes:
Test Conditions: All test data is referenced to 25°C ambient.
Operating Temperature Range: -40°C to +125°C.
Isat (Saturation Current): DC current (A) that will cause L₀ to drop approximately 10%.
Temperature Limit: The part temperature (ambient + temp rise) should not exceed 125°C under worst-case operating conditions.
Shape and Dimensions
Packaging
Packaging: Embossed Carrier Tape
Reel Diameter (A): 330 mm
Tape Width (W): 12 mm
Quantity/Reel: 1500 pcs
Solder Reflow Profile
Preheat condition: 150~200°C / 60~120 sec.
Allowed time above 217°C: 60~90 sec.
Max temp: 260°C
Max time at max temp: 10 sec.
Allowed Reflow time: 2x max
Solder paste: Sn/3.0Ag/0.5Cu
(Note: This profile is for qualification only and not meant to specify board assembly profiles. Actual profiles must be based on the customer's specific board design and process.)
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