The CD4532 Series is a cost-effective, wire-wound SMD Power Inductor that offers a balanced solution between component size and performance. It features a 4.5 mm × 4.0 mm footprint with a 3.2mm profile, making it a versatile smd coil for various DC-DC converter applications.
This series is built on a robust ferrite drum core with metallization, providing excellent shock resistance and durability. The CD4532 delivers strong current handling for its size, with saturation current (Isat) up to 4.0A. A common value like the 4.7 uh inductor in this series supports a 2.5A saturation current, highlighting its wide range of inductor applications. This CD4532 SMD Power Inductor features excellent solderability and heat resistance, and is packed in embossed carrier tape for automated assembly.
Key Features
Balanced Footprint: 4.5 mm × 4.0 mm × 3.2 mm package, balancing performance and PCB space.
Rugged Construction: Ferrite drum core with metallization for high shock resistance.
Excellent Current Handling: Saturation current (Isat) up to 4.0A.
Low DC Resistance (DCR).
Excellent Solderability & High Heat Resistance.
RoHS Compliant.
Applications
The CD4532's balanced design makes it a highly suitable SMD Power Inductor for various portable and stationary equipment:
DSC/DVC (Digital Still/Video Cameras), HDDs
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Notebooks, desktop computers
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LED Lighting
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Portable gaming devices, personal navigation systems
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Power supplies for OA equipment
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Electrical Characteristics
|
Part No. |
Inductance (L) (µH) |
Test Frequency (kHz/Volt) |
DCR (Ω) MAX. |
Saturation Current (Isat) (A) MAX. |
|
CD4532-1R0M |
1.0 ± 20% |
100/0.25 |
0.021 |
4.00 |
|
CD4532-1R5M |
1.5 ± 20% |
100/0.25 |
0.026 |
3.60 |
|
CD4532-2R2M |
2.2 ± 20% |
100/0.25 |
0.030 |
3.40 |
|
CD4532-2R7M |
2.7 ± 20% |
100/0.25 |
0.045 |
3.00 |
|
CD4532-3R3M |
3.3 ± 20% |
100/0.25 |
0.055 |
2.80 |
|
CD4532-4R7M |
4.7 ± 20% |
100/0.25 |
0.076 |
2.50 |
|
CD4532-6R8M |
6.8 ± 20% |
100/0.25 |
0.100 |
1.80 |
|
CD4532-8R2M |
8.2 ± 20% |
100/0.25 |
0.124 |
1.65 |
|
CD4532-100K |
10 ± 10% |
100/0.25 |
0.140 |
1.60 |
|
CD4532-150K |
15 ± 10% |
100/0.25 |
0.210 |
1.20 |
|
CD4532-220K |
22 ± 10% |
100/0.25 |
0.316 |
1.00 |
|
CD4532-270K |
27 ± 10% |
100/0.25 |
0.403 |
0.90 |
|
CD4532-330K |
33 ± 10% |
100/0.25 |
0.466 |
0.80 |
|
CD4532-470K |
47 ± 10% |
100/0.25 |
0.770 |
0.70 |
|
CD4532-680K |
68 ± 10% |
100/0.25 |
0.986 |
0.50 |
|
CD4532-101K |
100 ± 10% |
100/0.25 |
1.500 |
0.44 |
|
CD4532-151K |
150 ± 10% |
100/0.25 |
2.110 |
0.35 |
|
CD4532-181K |
180 ± 10% |
100/0.25 |
2.420 |
0.30 |
|
CD4532-331K |
330 ± 10% |
100/0.25 |
3.600 |
0.15 |
Notes:
Test Conditions: All test data is referenced to 25°C ambient.
Operating Temperature Range: -40°C to +125°C.
Isat (Saturation Current): DC current (A) that will cause L₀ to drop approximately 10%.
Temperature Limit: The part temperature (ambient + temp rise) should not exceed 125°C under worst-case operating conditions.
Shape and Dimensions
Packaging
Packaging: Embossed Carrier Tape
Reel Diameter (A): 330 mm
Tape Width (W): 12 mm
Quantity/Reel: 2000 pcs
Solder Reflow Profile
Preheat condition: 150~200°C / 60~120 sec.
Allowed time above 217°C: 60~90 sec.
Max temp: 260°C
Max time at max temp: 10 sec.
Allowed Reflow time: 2x max
Solder paste: Sn/3.0Ag/0.5Cu
(Note: This profile is for qualification only and not meant to specify board assembly profiles. Actual profiles must be based on the customer's specific board design and process.)
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