The CD5825 Series is a low-profile, cost-effective wire-wound SMD Power Inductor. It is part of the 5.8mm family but offers a significantly reduced height, with a maximum profile of ~2.5mm, making it an ideal chip inductor for height-constrained designs.
Despite its low profile, the CD5825 series delivers robust performance, offering a saturation current (Isat) up to 4.0A (at 1.5µH). These smd power inductors feature a durable metallized ferrite core for shock resistance and provide excellent solderability. As key inductor components in a power circuit, the CD5825 is supplied in embossed carrier tape for automated assembly.
Key Features
Low Profile Design: Features a maximum height of approx 2.5mm, ideal for thin devices.
Good Current Handling: Saturation current (Isat) up to 4.0A.
Rugged Construction: Ferrite drum core with metallization for high shock resistance.
Cost-Effective: Reliable performance for cost-sensitive applications.
Automation-Ready: Supplied in embossed carrier tape.
RoHS Compliant.
Applications
The CD5825's low-profile design makes it a perfect choice for DC-DC converter applications in height-sensitive electronics:
LED Lighting modules
1
>>
Mobile phones, PDAs, MP3 players
2
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DSC/DVC (Digital Still/Video Cameras)
3
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Notebooks and other thin portable devices
4
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Power supplies for OA equipment
5
Electrical Characteristics
|
Part No. |
Inductance (L) (µH) |
Test Frequency (kHz/Volt) |
DCR (Ω) MAX. |
Saturation Current (Isat) (A) MAX. |
|
CD5825-1R5M |
1.5 ± 20% |
100/0.25 |
0.024 |
4.00 |
|
CD5825-2R2M |
2.2 ± 20% |
100/0.25 |
0.035 |
3.50 |
|
CD5825-3R3M |
3.3 ± 20% |
100/0.25 |
0.046 |
2.70 |
|
CD5825-4R7M |
4.7 ± 20% |
100/0.25 |
0.070 |
2.30 |
|
CD5825-6R8M |
6.8 ± 20% |
100/0.25 |
0.092 |
1.70 |
|
CD5825-100M |
10 ± 20% |
100/0.25 |
0.115 |
1.50 |
|
CD5825-150M |
15 ± 20% |
100/0.25 |
0.192 |
1.20 |
|
CD5825-220K |
22 ± 10% |
100/0.25 |
0.280 |
1.00 |
|
CD5825-330K |
33 ± 10% |
100/0.25 |
0.384 |
0.80 |
|
CD5825-470K |
47 ± 10% |
100/0.25 |
0.563 |
0.70 |
|
CD5825-680K |
68 ± 10% |
100/0.25 |
0.800 |
0.60 |
|
CD5825-101K |
100 ± 10% |
100/0.25 |
1.100 |
0.40 |
Notes:
Test Conditions: All test data is referenced to 25°C ambient.
Operating Temperature Range: -40°C to +125°C.
Isat (Saturation Current): DC current (A) that will cause L₀ to drop approximately 10%.
Temperature Limit: The part temperature (ambient + temp rise) should not exceed 125°C under worst-case operating conditions.
Shape and Dimensions
Packaging
Packaging: Embossed Carrier Tape
Reel Diameter (A): 330 mm
Tape Width (W): 12 mm
Quantity/Reel: 2000 pcs
Solder Reflow Profile
Preheat condition: 150~200°C / 60~120 sec.
Allowed time above 217°C: 60~90 sec.
Max temp: 260°C
Max time at max temp: 10 sec.
Allowed Reflow time: 2x max
Solder paste: Sn/3.0Ag/0.5Cu
(Note: This profile is for qualification only and not meant to specify board assembly profiles. Actual profiles must be based on the customer's specific board design and process.)
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