The CD7835 Series is a wire-wound SMD Power Inductor featuring a 7.8 mm × 7.0 mm footprint and a slim 3.5mm profile. This series is built with a metallized ferrite core inductor, offering robust shock resistance and durability in a cost-effective package.
The CD7835 is engineered for applications requiring a balance of compact size and good current handling. It provides a saturation current (Isat) up to 6.00A and an inductance range extending to 680µH. As a leading smd power inductor manufacturer, Magsonder ensures excellent solderability and heat resistance. This CD7835 SMD Power Inductor is fully compatible with automated SMT assembly processes.
Key Features
Slim Profile: 7.8 mm × 7.0 mm footprint with a 3.5mm height.
Good Current Handling: Saturation current (Isat) up to 6.00A.
Rugged Construction: Ferrite drum core with metallization for high shock resistance.
Cost-Effective Design: A reliable choice from a trusted smd inductor manufacturer.
Low DC Resistance (DCR).
RoHS Compliant.
Applications
The CD7835 series is a versatile SMD Power Inductor suitable for DC-DC converters and power supply lines in:
LED Lighting
1
>>
Notebooks, desktop computers, and servers
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Flat-screen TVs, blue-ray disc recorders, and set-top boxes
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Power supplies for VCR and OA equipment
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Telecom base stations
5
Electrical Characteristics
|
Part No. |
Inductance (L) (µH) |
Test Frequency (kHz/Volt) |
DCR (Ω) MAX. |
Saturation Current (Isat) (A) MAX. |
|
CD7835-1R0M |
1.0 ± 20% |
100/0.25 |
0.009 |
6.00 |
|
CD7835-1R5M |
1.5 ± 20% |
100/0.25 |
0.012 |
5.00 |
|
CD7835-2R2M |
2.2 ± 20% |
100/0.25 |
0.014 |
4.00 |
|
CD7835-3R3M |
3.3 ± 20% |
100/0.25 |
0.023 |
3.50 |
|
CD7835-4R7M |
4.7 ± 20% |
100/0.25 |
0.029 |
3.00 |
|
CD7835-6R8M |
6.8 ± 20% |
100/0.25 |
0.044 |
2.50 |
|
CD7835-100M |
10 ± 20% |
100/0.25 |
0.061 |
2.00 |
|
CD7835-150M |
15 ± 20% |
100/0.25 |
0.091 |
1.80 |
|
CD7835-220K |
22 ± 10% |
100/0.25 |
0.120 |
1.50 |
|
CD7835-330K |
33 ± 10% |
100/0.25 |
0.180 |
1.10 |
|
CD7835-470K |
47 ± 10% |
100/0.25 |
0.250 |
0.90 |
|
CD7835-680K |
68 ± 10% |
100/0.25 |
0.330 |
0.70 |
|
CD7835-101K |
100 ± 10% |
100/0.25 |
0.480 |
0.55 |
|
CD7835-151K |
150 ± 10% |
100/0.25 |
0.793 |
0.50 |
|
CD7835-221K |
220 ± 10% |
100/0.25 |
1.124 |
0.42 |
|
CD7835-331K |
330 ± 10% |
100/0.25 |
1.495 |
0.35 |
|
CD7835-471K |
470 ± 10% |
100/0.25 |
2.376 |
0.30 |
|
CD7835-681K |
680 ± 10% |
100/0.25 |
3.312 |
0.25 |
Notes:
Test Conditions: All test data is referenced to 25°C ambient.
Operating Temperature Range: -40°C to +125°C.
Isat (Saturation Current): DC current (A) that will cause L₀ to drop approximately 10%.
Temperature Limit: The part temperature (ambient + temp rise) should not exceed 125°C under worst-case operating conditions.
Shape and Dimensions
Packaging
Packaging: Embossed Carrier Tape
Reel Diameter (A): 330 mm
Tape Width (W): 16 mm
Quantity/Reel: 1000 pcs
Solder Reflow Profile
Preheat condition: 150~200°C / 60~120 sec.
Allowed time above 217°C: 60~90 sec.
Max temp: 260°C
Max time at max temp: 10 sec.
Allowed Reflow time: 2x max
Solder paste: Sn/3.0Ag/0.5Cu
(Note: This profile is for qualification only and not meant to specify board assembly profiles. Actual profiles must be based on the customer's specific board design and process.)
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