The NR1050 Series is the largest and most powerful SMD Power Inductor in the NR magnetic-resin shielded line. It is designed for high-power applications, featuring a robust 10.3 mm × 10.3 mm footprint with a 5.0mm height.
This series is engineered for high performance, offering an excellent saturation current (Isat) up to 19.5A and a low DCR. Its magnetic-resin shielded construction and closed magnetic circuit design effectively reduce acoustic "buzz" noise and minimize EMI. This combination of high power, low noise, and low EMI makes the NR1050 an ideal high reliability inductor choice for servers, telecom base stations, and high-power automotive systems.
Key Features
High Saturation Current: Rated up to 19.5A.
Large 10mm Footprint: 10.3 mm × 10.3 mm × 5.0 mm package for high-power handling.
Magnetic-Resin Shielded: Reduces buzz noise to ultra-low levels.
Low EMI: Closed magnetic circuit design reduces leakage flux.
High Reliability: Metallization on ferrite core results in excellent shock resistance.
RoHS Compliant.
Applications
The NR1050's high-power, low-noise design makes it a premier SMD Power Inductor choice for:
Servers, desktop computers, and graphic cards
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Telecom base stations
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Automotive systems
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High-power LED Lighting
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Flat-screen TVs and set-top boxes
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Electrical Characteristics
|
Part No. |
Inductance (L) (µH) |
Test condition |
DCR (Ω) (±30%) |
S.R.F. (MHz) Min. |
Saturation Current (Isat) (A) |
Heating Rating Current (Idc) (A) |
|
NR1050-1R0N |
1.0 ± 30% |
100 kHz, 1V |
0.014 |
55 |
19.5 |
11.0 |
|
NR1050-1R5N |
1.5 ± 30% |
100 kHz, 1V |
0.015 |
45 |
17.3 |
10.0 |
|
NR1050-2R2N |
2.2 ± 30% |
100 kHz, 1V |
0.019 |
36 |
13.6 |
8.60 |
|
NR1050-3R3N |
3.3 ± 30% |
100 kHz, 1V |
0.027 |
23 |
11.6 |
8.10 |
|
NR1050-4R7N |
4.7 ± 30% |
100 kHz, 1V |
0.030 |
20 |
10.0 |
6.40 |
|
NR1050-100M |
10 ± 20% |
100 kHz, 1V |
0.048 |
12 |
7.20 |
5.01 |
|
NR1050-150M |
15 ± 20% |
100 kHz, 1V |
0.059 |
10 |
6.00 |
4.52 |
|
NR1050-220M |
22 ± 20% |
100 kHz, 1V |
0.085 |
8.1 |
4.30 |
3.77 |
|
NR1050-330M |
33 ± 20% |
100 kHz, 1V |
0.118 |
6.6 |
4.00 |
3.20 |
|
NR1050-470M |
47 ± 20% |
100 kHz, 1V |
0.163 |
5.4 |
3.30 |
2.73 |
|
NR1050-680M |
68 ± 20% |
100 kHz, 1V |
0.235 |
4.1 |
3.00 |
2.27 |
|
NR1050-101M |
100 ± 20% |
100 kHz, 1V |
0.338 |
3.5 |
2.50 |
1.89 |
|
NR1050-221M |
220 ± 20% |
100 kHz, 1V |
0.675 |
2.5 |
1.80 |
1.34 |
|
NR1050-331M |
330 ± 20% |
100 kHz, 1V |
0.885 |
2.0 |
1.40 |
1.16 |
|
NR1050-471M |
470 ± 20% |
100 kHz, 1V |
1.430 |
1.7 |
1.20 |
0.92 |
|
NR1050-681M |
680 ± 20% |
100 kHz, 1V |
1.980 |
1.5 |
1.00 |
0.78 |
|
NR1050-102M |
1000 ± 20% |
100 kHz, 1V |
3.420 |
1.1 |
0.80 |
0.59 |
Notes:
Test Conditions: All test data is referenced to 25°C ambient.
Operating Temperature Range: -40°C to +125°C (ambient plus self-temperature rise).
Isat (Saturation Current): DC current (A) that will cause L₀ to drop approximately 30%.
Idc (Heating Current): DC current (A) that will cause an approximate ΔT of 40°C.
Temperature Limit: The part temperature (ambient + temp rise) should not exceed 125°C under worst-case operating conditions.
Shape and Dimensions
Packaging
Packaging: Embossed Carrier Tape
Reel Diameter: 330 mm
Tape Width: 24 mm
Quantity/Reel: 800 pcs
Solder Reflow Profile
Preheat condition: 150~200°C / 60~120 sec.
Allowed time above 217°C: 60~90 sec.
Max temp: 260°C
Max time at max temp: 10 sec.
Allowed Reflow time: 2x max
Solder paste: Sn/3.0Ag/0.5Cu
(Note: This profile is for qualification only. Actual profiles must be based on the customer's specific board design and process.)
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