The DLF2012 Series is a miniature, wire-wound SMD Data Line EMI Filter. It is designed with a compact 2.0 mm × 1.2 mm footprint and a low 1.2mm profile, making it ideal for noise suppression on high-speed differential signal lines in space-constrained applications.
This series utilizes a ferrite core inductor construction to provide excellent common mode impedance for filtering EMI. It is engineered to achieve a lower DC resistance and higher current capability inductor than typical filters of its size, with a rated current up to 400mA. The DLF2012 offers excellent solderability, heat resistance, and is suitable for reflow soldering. This SMD Data Line EMI Filter is a high-reliability component for signal integrity.
Key Features
Miniature Footprint: 2.0 mm × 1.2 mm × 1.2 mm package for high-density boards.
Common Mode EMI Suppression: Ferrite core construction provides high impedance at high frequencies.
Lower DCR: For minimal signal distortion.
High Current Tolerance: Rated current up to 400mA.
High Reliability: Good dimensions and easy surface mount assembly.
RoHS Compliant.
Applications
The DLF2012 is ideal for filtering common mode noise from high-speed differential signal lines and power lines, such as:
USB 2.0, IEEE1394
1
>>
LVDS, MIPI
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Power lines in portable equipment (e.g., digital cameras, mobile phones)
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Notebooks and other compact devices
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Electrical Characteristics
|
Part No. |
Impedance (Z) (Ω) @100MHz |
Rated Current (Idc) (mA) MAX. |
Rated Voltage (V) (DC) |
Withstanding Voltage (V) (DC) |
DC Resistance (R) (Ω) MAX. |
Insulation Resistance (IR) (MΩ) MIN. |
|
DLF2012-670-A40 |
67 |
400 |
50 |
125 |
0.25 |
10 |
|
DLF2012-900-A33 |
90 |
330 |
50 |
125 |
0.35 |
10 |
|
DLF2012-121-A37 |
120 |
370 |
50 |
125 |
0.30 |
10 |
|
DLF2012-181-A33 |
180 |
330 |
50 |
125 |
0.35 |
10 |
|
DLF2012-261-A30 |
260 |
300 |
50 |
125 |
0.40 |
10 |
|
DLF2012-361-A28 |
360 |
280 |
50 |
125 |
0.45 |
10 |
Notes:
Test Conditions: All test data is referenced to 25°C ambient.
Operating Temperature Range: -40°C to +85°C (ambient plus self-temperature rise).
Rated Current (Idc): DC current (A) that will cause an approximate ΔT of 15°C.
Impedance: Measured on an HP4287A (or equivalent) at 100MHz.
Performance Curve
Shape and Dimensions
Reliability
This product is qualified against a series of reliability tests, including High Temperature Storage, Low Temperature Storage, Humidity, and Thermal Shock. (See PDF page 113 for full details).
Packaging
Packaging: Embossed Carrier Tape
Reel Diameter: 178 mm (7 inches)
Tape Width: 8 mm
Quantity/Reel: 2000 pcs
Solder Reflow Profile
Preheat condition: 150~200°C / 60~120 sec.
Allowed time above 217°C: 60~90 sec.
Max temp: 260°C
Max time at max temp: 10 sec.
Allowed Reflow time: 2x max
Solder paste: Sn/3.0Ag/0.5Cu
(Note: This profile is for qualification only. Actual profiles must be based on the customer's specific board design and process.)
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